The minute size of the molecules and the amazing characteristics of parylene, already starting from the thickness of a monolayer, have lead researchers, developers, and scientists to attempt its use in miniaturization of mechanical (MEMS), medical, military, and civilian systems, and in fact, wherever weight and size are significant.
The parylene polymer is the best solution currently known on the market for chemical and electrical insulation, and consequently it serves as an excellent encapsulator for installations and infrastructures that require protection against humidity, chemicals, electrical insulation, etc.
The micron thickness of the parylene molecule and its effective penetration, also into very narrow cracks, have turned parylene into a perfect material for use as a nano encapsulator, and as a result of a list of the additional advantages of parylene, it is in fact a multi-layer solution to all the problems of micron packaging problems.
The parylene coating layer is unique in that it permits protection against a variety of types of harsh environments and extreme climates, both for the inner space and for the external envelope of the devices, and it is especially efficient in the area of transition between the various spaces.
It is possible today to manufacture cameras of the size of a pinhead and to significantly reduce the size of accessories modified from compressed and sintered powders, such as Tantalum cables and piezo components of various kinds that are made of compressed powders. In the past it was customary to locate these components in large and heavy rigid boxes, while today it is possible to “pack” these components inside a thin, strong and invasive layer of parylene. This also applies to the cores of miniature coils and magnets.
Parylene coatings and MEMS
Micro electro-mechanical systems (MEMS) display a level of miniaturization and a combination of electronic and mechanical components of sizes that do not permit their “packaging” except in parylene. Furthermore, in these systems the parylene is used as dry lubrication (thanks to its low friction coefficients) for the micro mechanical systems during execution of encapsulation and sealing, as well as electrical insulation for the electronics incorporated in the systems − all by means of one coating by means of a single product.