1. Data sheets & Certification Silane safety data sheet Chemical product and company identification Version 1.1. including Hazards identification, composition and more Downdload file IPA Safety Data sheet Safety Data Sheet according to 1907/2006/EC, Article 31 Printing date 21.09.2010 Revision: 18.04.2010
Identification of the substance/mixture and of the company/undertaking -
Product details: Trade name: propan-2-ol Downdload file Parylene C Safety Data sheet MSDS 0300045-01 Galaxyl C from 1/10/2002 Downdload file Simtal Ltd ISO Simtal ISO certification from THE STANDARDS INSTITUTION OF ISRAEL. Valid until June 2017 Downdload file 2. Parylene - Physical Properties & Specification Parylene - Physical Properties & Specification Summary table with elecrtrical, thermal, mechanical and general data. Downdload file 3. Repair and recondition post coating Repair and recondition post coating Repair and recoating of Parylene coated prited circuit boards, including Parylene removal options Repair and recondition Hebrew Repair and recondition of Parylene coated devices - Hebrew version Downdload file Evaluation of ESD Effects during removal of conformal coating This report details the results and conclusions of an experimental evaluation of a micro-abrasive blasting technique to remove urethane and parylene conformal coatings from printed wiring assemblies. This technique is being evaluated as a replacement for solvent based systems. Downdload file 4. Tin Whiskers and Parylene Simtal on tin whiskers and Parylene Tin Whiskers - The old but new major drawback of Tin circuitry, this article describes what are Tin Whiskers? How do tin whiskers occur? Factors affecting tin whiskers growth and theories involving Parylene C for prevention of tin whiskers Downdload file Woodrow - Conformal Coatings as a Tin Whisker Mitigation Strategy Evaluation of Conformal Coatings as a Tin Whiskers Mitigation Strategy Thomas A. Woodrow‚ Ph.D.
IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, April 18-20, 2005.
A study by Woodrow and Ledbury investigated the potential for conformal coatings in moderating / reducing tin whisker growth. It tested six different coatings for tin whiskers formation under different aging conditions. In their conclusions they stated that "Parylene C was the best coating for suppressing the formation of OSE's and whiskers. In addition, Parylene C will completely and uniformly coat component leads, unlike other coatings applied by spraying". Downdload file 5. Parylene C for long term protection in seawater Parylene C for long term protection in seawater
Production of individual marine organic aggregates using Paramagnetic Microspheres: A new tool for examining microbial associations with aggregates
IRD, UMR 5119 ECOSYM, Université Montpellier II, Place Bataillon, 34095 Montpellier, France Université Pierre et Marie Curie, UMR 7093, Laboratoire d’Océanographie de Villefranche, F-06230 Villefranche-sur-Mer, France 3CNRS, UMR 7093, Laboratoire d’Océanographie de Villefranche, F-06230 Villefranche-sur-Mer, France
"The Parylene C coating allows longterm resistance of the magnet to corrosive fluids such as seawater, electrolytes, proteins, enzymes, and lipids. It is an inert, hydrophobic, optically clear bio compatible polymer coating material often used in medical applications."Downdload file 6. Parylene based encapsulation Encapsulation utilizing a thin parylene-C This paper presents an embedded chip integra- tion technology that incorporates silicon housings and ﬂexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin ﬁlms. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylene- coated metal at body temperature (37 ◦C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a ﬂexible MEMS radio-frequency (RF) coil has been integrated with an RF identiﬁcation (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene–metal–Parylene thin-ﬁlm technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embed- ded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil. Downdload file Carbon Nanotubes on to CMOS Circuitry with Parylene-C Encapsulation Chia-Ling Chen1, Vinay Agarwal2, Sameer Sonkusale2 and Mehmet R. Dokmeci1 Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, USA Department of Electrical and Computer Engineering, Tufts University, Medford, MA, USA
This paper presents heterogeneous integration of Single-Walled Carbon Nanotubes (SWNTs) with CMOS integrated circuits using die-level post processing. The chip was fabricated using the AMI 0.5μm CMOS Technology. An electroless zincation process was performed over the Aluminum assembly electrodes (Metal 3 of CMOS technology) to clean and to coat the electrodes with a thin Zinc layer. Low temperature dielectrophoretic assembly was utilized for the placement of the SWNTs on to these electrodes. Encapsulating the CMOS chip with a thin (1μm) parylene-C layer stabilized the SWNT-electrode contact resistance and also provided environmental protection. Electrical measurements from the assembled SWNTs yield ohmic behavior with a two-terminal resistance of ~44KΩ. The SWNTs were incorporated on to the CMOS chip as a feedback element of a two-stage Miller compensated high gain operational amplifier.
The measured small signal ac gain (~1.95) from the inverting amplifier confirmed the successful integration of carbon nanotubes with the CMOS circuitry. This paper lays the foundation for the realization of next generation integrated nanosystems with active nanostructures on CMOS integrated circuits. Downdload file 7. Parylene C and RF transmission Parylene Packaging for RF Electronics Wen Li, Member, IEEE, Damien C. Rodger, Member, IEEE, Ellis Meng, Senior Member, IEEE, James D. Weiland, Senior Member, IEEE, Mark S. Humayun, Member, IEEE, and Yu-Chong Tai, Fellow, IEEE
This paper presents an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin films. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylenecoated metal at body temperature (37 ◦C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a flexible MEMS radio-frequency (RF) coil has been integrated with an RF identification (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene–metal–Parylene thin-film technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embedded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil. 8. Parylene and Bio-medical applications Problems and solution in coating of Bio medical devices Medical devices often need some form of protection from their immediate environment. However, with small, complex and sensitive components, the application of a protective coating, is not a trivial matter. This article discuss the problems and describes the solution. Downdload file Selectively coating luminal surface of stents Unite State patent discription . Downdload file
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